MicroCircuit Laboratories LLC

6102280161
Kennett Square-Pennsylvania-United States
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Listing Description

Hermetic Package Encapsulation including Robotic Cover Sealer with Robotic Materials Manager for batch loading of packages from Auer carriers or waffle packs/trays. MCL services include process development and prototyping with test. 99.9%+ seal yield guarantee!

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Exhibited

OFC26

Booth Number: 5017
EXHID: 584
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