Listing Description

SiliCool Technology was founded in December 2018.
Focusing on chip interconnection technology,we are committed to becoming the world leading manufacturer of full-scenario, high_x0002_precision bonding equipment.
Optical communication high-speed chip Bonder, IB/PT series benchmarks against international leaders MRSI, datacon, ASM;shipped more than 300 units since 2024.

Exhibited

OFC26

Booth Number: 5408
EXHID: 1049

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