Advanced Packaging Interlink Holding Pte Ltd
Listing Description
API is a global manufacturer specializing in advanced packaging equipment, including thermo-compression bonders and wafer-level hybrid bonding systems. Our systems are primarily used in advanced packaging for HBM, high-performance CPUs/GPUs, and 2.5D/3D integration for AI chips. Headquartered in Singapore, with branches and service teams in the US, Japan, and Malaysia.